COOL Chips I

Kikai-Shinko-Kaikan, Tokyo, Japan

April 15, 1998

Wednesday, April 15

Opeing Session

Session Chair:Dr. Hisao Koizumi, (Mitsubishi Elec. Corp.)

Session 1

Session Chair:Dr. Akihiro Morino, (NEC Corp.)

The Future of Microprocessor Architecture

Dr. Donald Alpert, (Intel Corp.)

Aspects of the Next-Generation Power-PC Architecture

Mr. Peter Wilson, (IBM/Motorola Development Center)

Session 2

Session Chair:Mr. Eiji Masuda (Toshiba Corp.)

Architecture in Post-RISC Microprocessors

Prof. Kai Hwang, (The Univ. of Hong Kong)

A 60mW MPEG4 Video Codec for Mobile Multimedia Applications

Mr. Hideo Arakida, (Toshiba Corp.)

Session 3

Session Chair:Mr. Toshifumi Miki (OKI Elec. Corp.)

A Multimedia RISC Processor with Flexible System Extension Capability

Mr. Atsushi Okamura, (NEC Corp.)

Low0Power, High-Performance Microprocessors for Multimedia Application (SH4 and SH3/DSP-Merged Processor)

Mr. Kunio Uchiyama (Hitachi, Ltd.)

Panel Session

“Future Trends in Microprocessors”

Moderator:

Prof. Toshiyasu L. Kunii, (Hosei University)

Panelist :

Dr. Donald Alpert, (Intel Corp.)

Mr. Peter Wilson, (IBM/Motorola Development Center)

Prof. Kai Hwang, (The Univ. of Hong Kong)

Mr. Hajime Kubosawa (Fujitsu Lab. Ltd.)

Mr. Toyohiko Yoshida (Mitsubishi Electronics Corp.)

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