COOL Chips XIV
Yokohama Joho Bunka Center (Yokohama Media & Communications Center),
Yokohama, Japan
Call for Contribution
Call for Participation
Advanced Program
Registration
Organizing Committee
Program Committee
Advisory Committee
Travel Information
Past COOLCHIPS

Sister Conferences HOT CHIPS HOT INTERCONNECTS

Advisory Committee:

Chair
T. Nakamura (Keio Univ.)
Chair Emeritus
M. J. Flynn (Stanford Univ.)
Advisory Emeritus
T. L. Kunii (Univ. of Tokyo)
Members
D. Allison (Stanford Univ.)
D. B. Alpert (Camelback Computer Architecture)
A. J. Baum (Intel)
D. A. Draper (True Circuits)(TCMCOMP Chair)
M. A. Franklin (Washington Univ.)
G. Goto (Yamagata Univ.)
Y. Hagiwara (Sojo Univ./AIPS)
M. Hase (NTT)
S. Hijiya (Fujitsu Labs.)
S. Iwade (Osaka Inst. of Tech.)
L. Jow (Hewlett-Packard)
R. Kasai (NTT Electronics)
S. Kohyama (Covalent Materials)
T. Kunio (NEC)
T. Makimoto (TechnoVision Consulting)
O. Mencer (Imperial College)
H. Mochida (Rohm)
A. Morino (SIRIJ)
J. Naganuma (NTT Electronics)
M. Nishihara (AIPS)
T. Nukii (Sharp)
T. Ogura (Ritsumeikan Univ. )
A. Omondi (Yonsei Univ.)
K. Sasaki (Hitachi ULSI)
K. Shimohigashi (STARC)
T. Tabata (Sanyo Electric)
T. Watanabe (Riken)
N. Woo (Samsung)
S. Yamaguchi (Panasonic)
(in alphabetical order)
As of August 6, 2010