IEEE Symposium on Low-Power and High-Speed Chips
COOL Chips XIII
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan) on April 14 - 16, 2010
General Information
Call for Contribution
Call for Participation
Advanced Program
Registration
Organizing Committee
Program Committee
Advisory Committee
Travel Information

Sister Conferences HOT CHIPS HOT INTERCONNECTS

 Organizing Committee:

Chair
M. J. Flynn (Stanford Univ.)
Vice Chair
T. L. Kunii (Kanazawa Inst. of Tech.)
Members
D. Allison (Stanford Univ.)
D. B. Alpert (Camelback Computer Architecture)
A. J. Baum (Intel)
D. A. Draper (True Circuits)(TCMCOMP Chair)
M. A. Franklin (Washington Univ.)
G. Goto (Yamagata Univ.)
M. Hase (NTT)
S. Hijiya (Fujitsu Labs.)
S. Iwade (Osaka Inst. of Tech.)
L. Jow (Hewlett-Packard)
R. Kasai (NTT Electronics)
S. Kohyama (Covalent Materials)
T. Kunio (NEC)
T. Makimoto (TechnoVision Consulting)
O. Mencer (Imperial College)
H. Mochida (Rohm)
A. Morino (SIRIJ)
J. Naganuma (NTT Electronics)
K. Nagasawa (Renesas Tech.)
T. Nukii (Sharp)
A. Omondi (Yonsei Univ.)
K. Sasaki (Hitachi ULSI)
K. Shimohigashi (STARC)
T. Tabata (Sanyo Electric)
T. Watanabe (Riken)
N. Woo (Samsung)
S. Yamaguchi (Panasonic)
(in alphabetical order)
As of September 15, 2009