IEEE Symposium on Low-Power and High-Speed Chips
COOL Chips XIII
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan) on April 14 - 16, 2010
General Information
Call for Contribution
Call for Participation
Advanced Program
Registration
Organizing Committee
Program Committee
Advisory Committee
Travel Information

Sister Conferences HOT CHIPS HOT INTERCONNECTS

 Organizing Committee:

Chair
T. Nakamura (Keio Univ.)
Vice Chairs
Y. Hagiwara (Sojo Univ. / AIPS )
H. Kobayashi (Tohoku Univ.)
J. Torrellas (Univ. of Illinois, Urbana-Champaign)
K. Uchiyama (Hitachi)
C. -M. Kyung (KAIST)
Secretary
K. Suzuki (NEC Electronics)
Treasurers
T. Ogura (Ritsumeikan Univ.)
H. Iwasaki (NTT)
Program Chairs
M. Ikeda (Univ. of Tokyo)
F. Arakawa (Renesas Tech.)
Publicity Chairs
M. Suzuki (Panasonic)
K. Hosokawa (IBM)
M. Nishihara (AIPS)
Publication Chairs
Y. Unekawa (Toshiba)
Y. Hirose (Fujitsu Labs. )
Registration Chairs
Y. Mori (Oki Network LSI)
R. Egawa (Tohoku Univ.)
Local Arrangement Chairs
Y. Nitta (Renesas Tech.)
A. Hashiguchi (Sony)
Web Manager
Y. Sato (JAIST)