D. Allison (Stanford Univ.)
D. B. Alpert (Camelback Computer Architecture)
A. J. Baum (Intel)
D. A. Draper (True Circuits)(TCMCOMP Chair)
M. A. Franklin (Washington Univ.)
G. Goto (Yamagata Univ.)
Y. Hagiwara (Sojo Univ./AIPS)
S. Iwade (Osaka Inst. of Tech.)
L. Jow (Hewlett-Packard)
R. Kasai (NTT Electronics)
S. Kohyama (Covalent Materials)
T. Kunio (NEC)
K. Kushima (NTT)
T. Makimoto (TechnoVision Consulting)
O. Mencer (Imperial College)
H. Mochida (Rohm)
Y. Mori (CM Engineering)
J. Naganuma (Shikoku Univ.)
M. Nishihara (AIPS)
T. Nukii (Sharp)
T. Ogura (Ritsumeikan Univ. )
Y. Okamoto (Panasonic)
A. Omondi (Yonsei Univ.)
T. Shimizu (Renesas)
T. Tabata (ON Semiconductor)
T. Watanabe (Riken)
N. Woo (Samsung)
H. -J. Yoo (KAIST)
H. Yoshizawa (Fujitsu Labs.)
