IEEE Symposium on Low-Power and High-Speed Chips
COOL Chips XII
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan) on April 15 - 17, 2009

Sister Conferences HOT CHIPS 16 HOT INTERCONNECTS 12


Advisory Committee:
Chair M. J. Flynn (Stanford Univ.)
Vice Chair T. L.Kunii (Morpho Inc.)
Members D. Allison (Stanford Univ.)
D. B. Alpert (Camelback Computer Architecture)
A. J. Baum (Intel)
M. A. Franklin (Washington Univ.)
G. Goto (Yamagata Univ.)
M. Hase (NTT)
S. Hijiya (Fujitsu Labs.)
S. Iwade (Osaka Inst. of Tech.)
J. Iwamura (Toshiba)
L. Jow (Hewlett-Packard (TCMCOMP Chair))
R. Kasai (NTT Electronics)
S. Kohyama (Covalent Materials Corp)
T. Kunio (NEC)
T. Makimoto (TechnoVision Consulting)
O. Mencer (Imperial College)
H. Mochida (Rohm)
A. Morino (SIRIJ)
K. Nagasawa (Renesas Tech.)
T. Nukii (Sharp)
A. Omondi (Yonsei Univ.)
H. Sasaki (NEC)
K. Sasaki (Hitachi ULSI)
K. Shimohigashi (STARC)
T. Tabata (Sanyo Electric)
S. Takahashi (Oki Electric Ind.)
T. Watanabe (RIKEN, Japan)
N. Woo (Samsung)
S. Yamaguchi (Matsushita)
(in alphabetical order)