IEEE Symposium on Low-Power and High-Speed Chips
COOL Chips XII
Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan) on April 15 - 17, 2009

Sister Conferences HOT CHIPS 16 HOT INTERCONNECTS 12


Program Committee:
Chairs M. Ikeda (Univ.of Tokyo)
F. Arakawa (Renesas Tech.)
Vice Chair H. Shimada (Kyoto Univ.)
Poster Chair M. Muroyama (Tohoku Univ.)
Special Session Chair K. Inoue (Kyusyu Univ.)
Member S. Y.Borkar (Intel)
K. -R. Cho (Chungbuk National Univ.)
M. Harada (Tohoku Univ.)
K. Hashimoto (Fukuoka Univ.)
T. Hashimoto (Matsushita)
K. Hirairi (Sony)
H. Igura (NEC)
H. Kawaguchi (Kobe Univ.)
K. Kimura (Waseda Univ.)
T. Kodaka (Toshiba)
Y. Kodama (AIST)
M. Kondo (UEC)
M. Kuga (Kumamoto Univ.)
G. Lee (Korea Univ.)
T. Miyazaki (Univ. of Aizu)
H. Nakamura (Univ. of Tokyo)
H. Nakata (Hitachi)
Y. Sato (JAIST)
Y. Shibata (Nagasaki Univ.)
M. H. Sunwoo (Ajou Univ.)
O. Takahashi (IBM, USA)
H. Takizawa (Tohoku Univ.)
N. Togawa (Waseda Univ.)
T. -H. Tsai (NCU)
T. Tsutsumi (Meiji Univ.)
U. Walterscheidt (Intel)
H. Yamauchi (SAMSUNG)
K. S. Yeo (NTU, Singapore)
T. Yoshitake (Fujitsu Labs.)
* in alphabetical order
As of December 5, 2008