COOLChips 22

IEEE Symposium on Low-Power and High-Speed Chips 22
コンテンツへスキップ
  • General Information
  • Call for Contributions
  • Call for Participation
  • Advance Program
  • Registration
  • Exhibition
  • Travel Information
  • Committees
  • Past COOLChips
  • Mailing list

Past COOLChips

  • COOLChips 21 2018
  • COOLChips 20 2017
  • COOLChips XIX 2016
  • COOLChips XVIII 2015
  • COOLChips XVII 2014
  • COOLChips XVI 2013
  • COOLChips XV 2012
  • COOLChips XIV 2011
  • COOLChips XIII 2010
  • COOLChips XII 2009
  • COOLChips XI 2008
  • COOLChips X 2007
  • COOLChips IX 2006
  • COOLChips VIII 2005
  • COOLChips VII 2004
  • COOLChips VI 2003
  • COOLChips V 2002
  • COOLChips IV 2001
  • COOLChips III 2000
  • COOLChips II 1999
  • COOLChips I 1998

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Sponsored by Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society.

In cooperation with the IEICE Electronics Society and IPSJ.



COOC Chips 22 is supported by Yokohama Convention & Visitors Bureau.



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